Semiconductor packages and methods of packaging semiconductor devices

• Main Authors: Micla Wedanni Linsangan, Tan Hua Hong, Ho Beng Yeung, Suthiwongsunthorn Nathapong, Huang Rui, Le Kriangsak Sae, De Vera Nelson Agbisit, Robles Roel Adeva, Dimaano Antonio Jr. Bambalan
• Format: Patent
• Language: English
• Published: 29.11.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a wafer having first and second major surfaces. The wafer is prepared with a plurality of dies and a plurality of external electrical contacts disposed on the first major surface of the wafer. The method includes processing the wafer. Processing the wafer includes separating the wafer into a plurality of individual dies. An individual die includes first and second major surfaces and first and second sidewalls, and the external electrical contacts are formed on the first major surface of the die. An encapsulant material is formed. The encapsulant material covers at least a portion of the first and second sidewalls of the die.