Integrated circuit component shielding

Embodiments of shielding apparatuses are disclosed herein. In some embodiments, a shielding apparatus may include first and second conductive regions and a plurality of vias disposed between the first and second conductive regions. The first and second conductive regions and the plurality of vias ma...

Full description

Saved in:
Bibliographic Details
Main Authors Saraswat Ruchir, Cowley Nicholas P
Format Patent
LanguageEnglish
Published 22.11.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Embodiments of shielding apparatuses are disclosed herein. In some embodiments, a shielding apparatus may include first and second conductive regions and a plurality of vias disposed between the first and second conductive regions. The first and second conductive regions and the plurality of vias may surround an integrated circuit (IC) component and individual vias of the plurality of vias are spaced relative to one another to shield incoming or outgoing electromagnetic interference (EMI). Other embodiments may be described and/or claimed.
Bibliography:Application Number: US201615008230