Acoustic wave device built-in module and communication device

An acoustic wave device built-in module includes: a multilayer wiring board formed by stacking an insulating layer and a wiring layer; an acoustic wave device embedded in the multilayer wiring board; and an electronic component located on the multilayer wiring board and electrically coupled to the a...

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Bibliographic Details
Main Author Tajima Motoyuki
Format Patent
LanguageEnglish
Published 25.10.2016
Subjects
ACOUSTICS
ACOUSTICS NOT OTHERWISE PROVIDED FOR
BASIC ELECTRONIC CIRCUITRY
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERATION
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL
MUSICAL INSTRUMENTS
PHYSICS
RESONATORS
SOUND-PRODUCING DEVICES
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Summary:An acoustic wave device built-in module includes: a multilayer wiring board formed by stacking an insulating layer and a wiring layer; an acoustic wave device embedded in the multilayer wiring board; and an electronic component located on the multilayer wiring board and electrically coupled to the acoustic wave device, wherein the acoustic wave device includes: an electrode that is located on a substrate and excites an acoustic wave; and a sealing portion that includes a frame body located on the substrate so as to surround the electrode and a lid located on the frame body so as to form an air space above the electrode, and the lid is recessed toward the substrate.
Bibliography:Application Number: US201313903760