Circuit substrate and method of manufacturing same

A circuit interconnecting substrate manufacturing method includes depositing a first layer of metallic powder on top of a carrier, and then forming a first layer of electrically conductive traces from the first layer of metallic powder. A second layer of metallic powder is then deposited onto at lea...

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Bibliographic Details
Main Authors Foong Chee Seng, Tan Lan Chu
Format Patent
LanguageEnglish
Published 18.10.2016
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A circuit interconnecting substrate manufacturing method includes depositing a first layer of metallic powder on top of a carrier, and then forming a first layer of electrically conductive traces from the first layer of metallic powder. A second layer of metallic powder is then deposited onto at least one region of the first layer of electrically conductive traces. Then a second layer of electrically conductive traces is formed from the second layer of metallic powder and each trace of the second layer is electrically coupled to a trace of the first layer. An insulating material is deposited onto the carrier to provide an insulating substrate that supports the traces. The method does not require the use of any wet chemicals or chemical etching steps.
Bibliography:Application Number: US201414151828