Nonplanar antenna embedded package structure and method of manufacturing the same

A nonplanar antenna embedded package structure and a method of manufacturing the same are introduced. The structure includes a nonplanar antenna component. The nonplanar antenna component comprises an antenna substrate, metal wiring, through-hole, and metal bump. The substrate surface covers the met...

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Bibliographic Details
Main Authors Wang Chih, Lee Chun-Yu, Chang Chia-Hua, Chiang Chi-Haw
Format Patent
LanguageEnglish
Published 18.10.2016
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRICITY
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Summary:A nonplanar antenna embedded package structure and a method of manufacturing the same are introduced. The structure includes a nonplanar antenna component. The nonplanar antenna component comprises an antenna substrate, metal wiring, through-hole, and metal bump. The substrate surface covers the metal wiring. The through-hole penetrates the substrate from the antenna substrate bottom side but does not penetrate the metal wiring, and does not affect its appearance. The metal bump is implanted in the through-hole from the antenna substrate bottom side to join the metal wiring. An electronic component having a copper cable is provided. An end of the copper cable protrudes from the electronic component and is inserted into the through-hole of the antenna component to join the metal bump, thereby forming the nonplanar antenna embedded package structure characterized by: preventing the antenna metal wiring from exposing, and reducing interference otherwise arising from antenna resonance frequency and noise.
Bibliography:Application Number: US201414551192