Substrate via filling

• Main Authors: Cordes Steven A, Kang Sung K, Dang Bing, Sorce Peter J, Luo Yu
• Format: Patent
• Language: English
• Published: 30.08.2016
• Subjects: APPARATUS THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SPRAYING OR ATOMISING IN GENERAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate.