Polishing head with alignment gear

• Main Authors: TANG PEI, WU KUN-TAI
• Format: Patent
• Language: English
• Published: 19.07.2016
• Subjects: BLASTING; BRAKES; CLUTCHES; COUPLINGS FOR TRANSMITTING ROTATION; DRESSING OR CONDITIONING OF ABRADING SURFACES; ENGINEERING ELEMENTS AND UNITS; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; GRINDING; HEATING; LIGHTING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MECHANICAL ENGINEERING; PERFORMING OPERATIONS; POLISHING; THERMAL INSULATION IN GENERAL; TRANSPORTING; WEAPONS

Among other things, one or more techniques and/or systems are provided for driving a body of a polishing head using an alignment gear. That is, an alignment gear, coupled to a housing of the polishing head, can transfer rotational force from the housing to the body responsive to the alignment gear being mated with a channel associated with the body. For example, the housing can supply pressure to the body, resulting in the body and the housing moving towards one another into a mated state. When the body and the housing are in the mated state, the alignment gear can mate with the channel (e.g., the alignment gear can fit within the channel). In this way, the alignment gear can drive the body by transferring rotational force to the body, resulting in the body rotating a semiconductor wafer against a polishing pad to polish the semiconductor wafer, for example.