Electrolytic copper foil, cleaning fluid composition and method for cleaning copper foil

An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The p...

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Bibliographic Details
Main Authors LIU YUEH-MIN, LAI YAO-SHENG, JUO TSANG-JIN, LO HSI-HSING, CHOU JUIANG, CHENG KUEI-SEN
Format Patent
LanguageEnglish
Published 12.07.2016
Subjects
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
APPARATUS THEREFOR
AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKINGWITHOUT ESSENTIALLY REMOVING MATERIAL
CANDLES
CHEMISTRY
CLEANING
CLEANING IN GENERAL
DETERGENT COMPOSITIONS
DETERGENTS
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
FATTY ACIDS THEREFROM
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES,OTHERWISE THAN BY ROLLING
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL
METALLURGY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
PUNCHING METAL
RECOVERY OF GLYCEROL
RESIN SOAPS
SOAP OR SOAP-MAKING
TRANSPORTING
USE OF SINGLE SUBSTANCES AS DETERGENTS
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Summary:An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.
Bibliography:Application Number: US201314046077