Semiconductor device

A semiconductor flat package has a semiconductor chip, leads connected to the semiconductor chip, and an encapsulation resin covering the semiconductor chip and partially covering the leads. Outer end surfaces of the leads are exposed from the encapsulation resin and covered with a plated layer, and...

Full description

Saved in:
Bibliographic Details
Main Author YOSHINO TOMOYUKI
Format Patent
LanguageEnglish
Published 05.07.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor flat package has a semiconductor chip, leads connected to the semiconductor chip, and an encapsulation resin covering the semiconductor chip and partially covering the leads. Outer end surfaces of the leads are exposed from the encapsulation resin and covered with a plated layer, and a side end surface of the plated layer and a side end surface of the encapsulation resin are flush with each other. A material with good solder wettability is formed at a lead cut portion of the semiconductor flat package, to thereby improve solder connection strength with a circuit board. A solder fillet is formed from the lead cut portion of the semiconductor package, to thereby enable adaptation of solder automatic visual inspection after mounting.
Bibliography:Application Number: US201414485927