Method for packaging secondary optical element

The present invention relates to a method for packaging secondary optical element. By coating optical glue on the bottom surface of the secondary optical element and on the substrate and by hardening individually, as well as using the technical characteristics of flipping the substrate and the fixtu...

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Bibliographic Details
Main Authors LEE YUEH-MU, HONG HWEN-FEN, SHIN HWA-YUH, LIANG YI-PING, SHIH ZUN-HAO
Format Patent
LanguageEnglish
Published 05.07.2016
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The present invention relates to a method for packaging secondary optical element. By coating optical glue on the bottom surface of the secondary optical element and on the substrate and by hardening individually, as well as using the technical characteristics of flipping the substrate and the fixture, the secondary optical element can fall naturally and be positioned above an optoelectric device such as a solar cell or a light-emitting diode. No additional fastener is required for supporting the secondary optical element.
Bibliography:Application Number: US201414451516