Stress reduction apparatus

A stress reduction apparatus comprises a metal structure formed over a substrate, an inter metal dielectric layer formed over the substrate, wherein a lower portion of the metal structure is embedded in the inter metal dielectric layer and an inverted cup shaped stress reduction layer formed over th...

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Bibliographic Details
Main Authors LU YING-TI, MAO MING-RAY, TSAI KUANI, CHEN WEN-TSAO
Format Patent
LanguageEnglish
Published 21.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A stress reduction apparatus comprises a metal structure formed over a substrate, an inter metal dielectric layer formed over the substrate, wherein a lower portion of the metal structure is embedded in the inter metal dielectric layer and an inverted cup shaped stress reduction layer formed over the metal structure, wherein an upper portion of the metal structure is embedded in the inverted cup shaped stress reduction layer.
Bibliography:Application Number: US201314137765