Electronic device and manufacturing method therefor

An electronic device includes a substrate, a first conductive layer disposed over the substrate, an organic insulating layer, including an organic material, disposed over the first conductive layer and having an aperture exposing a portion of the first conductive layer, a second conductive layer, wh...

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Bibliographic Details
Main Authors YADA SHUHEI, NENDAI KENICHI, ABE YUUKI, SUGANO KOU
Format Patent
LanguageEnglish
Published 31.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic device includes a substrate, a first conductive layer disposed over the substrate, an organic insulating layer, including an organic material, disposed over the first conductive layer and having an aperture exposing a portion of the first conductive layer, a second conductive layer, which is metallic, covering a top face of the organic insulating layer, an inner circumferential face that faces the aperture in the organic insulating layer, and the exposed portion of the first conductive layer, and an intermediate layer that includes an oxide or a nitride, disposed only between the second conductive layer and the inner circumferential face that faces the aperture in the organic insulating layer. The first conductive layer and the second conductive layer are in contact at the bottom face of the aperture in the organic insulating layer.
Bibliography:Application Number: US201314371073