Implantable medical device header

• Main Authors: ZHAO YANZHU, PRASANNAKUMAR JEEVAN M, BATES DAVID, HAENISCH CHRISTOPHER M, OLSON JOHN C, WEIAND JASON P, PATRAS GEORGE
• Format: Patent
• Language: English
• Published: 17.05.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROTHERAPY; HUMAN NECESSITIES; HYGIENE; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; MAGNETOTHERAPY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEDICAL OR VETERINARY SCIENCE; PERFORMING OPERATIONS; PRINTED CIRCUITS; RADIATION THERAPY; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; ULTRASOUND THERAPY; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.