Universal solder joints for 3D packaging

Electronic devices including solder bumps embedded in a pre-applied coating of underfill material and/or solder resist are fabricated, thereby improving chip-package interaction reliability. Underfill can be directly applied to a wafer, enabling increased filler loadings. Passages formed in the unde...

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Bibliographic Details
Main Authors NAH JAE-WOONG, PERFECTO ERIC D, ERWIN BRIAN M, POLOMOFF NICHOLAS A
Format Patent
LanguageEnglish
Published 17.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Electronic devices including solder bumps embedded in a pre-applied coating of underfill material and/or solder resist are fabricated, thereby improving chip-package interaction reliability. Underfill can be directly applied to a wafer, enabling increased filler loadings. Passages formed in the underfill and/or solder resist coating expose electrically conductive pads or metal pillars. Such passages can be filled with molten solder to form the solder bumps.
Bibliography:Application Number: US201414181616