Semiconductor device, manufacturing method for semiconductor device, and electronic device

There is provided a semiconductor device including a first semiconductor base substrate, a second semiconductor base substrate that is bonded onto a first surface side of the first semiconductor base substrate, a through electrode that is formed to penetrate from a second surface side of the first s...

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Main Authors WAKIYAMA SATORU, OOKA YUTAKA, ZAIZEN YOSHIFUMI, HANEDA MASAKI, NAGAHATA KAZUNORI, OKAMOTO MASAKI, SHOHJI REIJIROH
Format Patent
LanguageEnglish
Published 17.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:There is provided a semiconductor device including a first semiconductor base substrate, a second semiconductor base substrate that is bonded onto a first surface side of the first semiconductor base substrate, a through electrode that is formed to penetrate from a second surface side of the first semiconductor base substrate to a wiring layer on the second semiconductor base substrate, and an insulation layer that surrounds a circumference of the through electrode formed inside the first semiconductor base substrate.
Bibliography:Application Number: US201314409634