Die edge sealing structures and related fabrication methods

Die structures for electronic devices and related fabrication methods are provided. An exemplary die structure includes a diced portion of a semiconductor substrate that includes a device region having one or more semiconductor devices fabricated thereon and an edge sealing structure within the semi...

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Bibliographic Details
Main Authors YANG HONGNING, ZHANG ZHIHONG, ZUO JIANG-KAI
Format Patent
LanguageEnglish
Published 03.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Die structures for electronic devices and related fabrication methods are provided. An exemplary die structure includes a diced portion of a semiconductor substrate that includes a device region having one or more semiconductor devices fabricated thereon and an edge sealing structure within the semiconductor substrate that circumscribes the device region. In one or more embodiments, the edge sealing structure includes a conductive material that contacts a handle layer of semiconductor material, a crackstop structure is formed overlying the sealing structure, wherein the crackstop structure and the edge sealing structure provide an electrical connection between the handle layer and an active layer of semiconductor material that overlies a buried layer of dielectric material on the handle layer.
Bibliography:Application Number: US201414505842