System and method for forming bonded substrates

An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transpo...

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Bibliographic Details
Main Authors KANUNGO MANDAKINI, ZHOU JING, HONG WEI, JIA NANCY Y, BEACHNER JAMES R, MCCONVILLE PAUL J
Format Patent
LanguageEnglish
Published 23.02.2016
Subjects
CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MEASURING
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
PHYSICS
TESTING
TRANSPORTING
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Summary:An apparatus for bonding two substrates includes a first roller, a second roller that forms a nip with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transport to move the first substrate and the second substrate through the nip simultaneously, with a pattern of a hydrophobic material on a first side of the first substrate engaging a first side of the second substrate. The first substrate engages the first roller, which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together.
Bibliography:Application Number: US201414311970