Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

• Main Authors: VREMAN GERRIT J, PEARSON TOM E, TSENG JIA-HUNG, CHANG PETER L
• Format: Patent
• Language: English
• Published: 16.02.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PHYSICS; SEMICONDUCTOR DEVICES

An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may...