Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies

An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may...

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Bibliographic Details
Main Authors VREMAN GERRIT J, PEARSON TOM E, TSENG JIA-HUNG, CHANG PETER L
Format Patent
LanguageEnglish
Published 16.02.2016
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:An optical touchscreen assembly may employ a photonic chip packaged with a chip surface at an angle inclined between horizontal and vertical orientations. An inclined paddle sawn flat no-leads (IPSFN) package may be affixed to a cover glass surface along a perimeter of a display. IPSFN packages may incorporate a photo-emitter chip and a photo-detector chip that may be inclined for a desired angle of incidence relative to the cover glass. A CMOS integrated optical transceiver package may include inclined photonic chips and a non-inclined CMOS chip having at least one of a photo-emitter driver, or a photo-detector TIA and/or ADC. A chip package lead frame may include cantilevered paddle tabs amenable to controlled deflection during package assembly. An inclined packaging assembly method may include attaching a chip to a lead frame paddle and form pressing the lead frame to incline the chip to a desired angle before encapsulation.
Bibliography:Application Number: US201314141026