Data center thermal management

• Main Authors: HAMANN HENDRIK F, LI HONGFEI
• Format: Patent
• Language: English
• Published: 09.02.2016
• Subjects: CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; PHYSICS; PRINTED CIRCUITS; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR

Historical high-spatial-resolution temperature data and dynamic temperature sensor measurement data may be used to predict temperature. A first formulation may be derived based on the historical high-spatial-resolution temperature data for determining a temperature at any point in 3-dimensional space. The dynamic temperature sensor measurement data may be calibrated based on the historical high-spatial-resolution temperature data at a corresponding historical time. Sensor temperature data at a plurality of sensor locations may be predicted for a future time based on the calibrated dynamic temperature sensor measurement data. A three-dimensional temperature spatial distribution associated with the future time may be generated based on the forecasted sensor temperature data and the first formulation. The three-dimensional temperature spatial distribution associated with the future time may be projected to a two-dimensional temperature distribution, and temperature in the future time for a selected space location may be forecasted dynamically based on said two-dimensional temperature distribution.