Chemical mechanical polishing machine and polishing head assembly

A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.

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Bibliographic Details
Main Authors KIM KYUNG-HYUN, PARK KI-JONG, KIM IN-KWON, LIM JONG-HEUN, BAE KI-HO
Format Patent
LanguageEnglish
Published 09.02.2016
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:A chemical mechanical polishing machine includes a polishing head assembly including a polishing head body and a membrane disposed at a bottom of the polishing head body. The bottom surface of the membrane includes a hydrophobic area and a hydrophilic area.
Bibliography:Application Number: US201314045157