Independent gate vertical FinFET structure

A semiconductor device includes a substrate extending in a first direction to define a substrate length and a second direction perpendicular to the first direction to define a substrate width. A first semiconductor fin is formed on an upper surface of the substrate. The first semiconductor fin exten...

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Bibliographic Details
Main Authors YAMASHITA TENKO, LIU ZUOGUANG, BASKER VEERARAGHAVAN S, YEH CHUNN
Format Patent
LanguageEnglish
Published 02.02.2016
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Summary:A semiconductor device includes a substrate extending in a first direction to define a substrate length and a second direction perpendicular to the first direction to define a substrate width. A first semiconductor fin is formed on an upper surface of the substrate. The first semiconductor fin extends along the second direction at a first distance to define a first fin width. A first gate channel is formed between a first source/drain junction formed in the substrate and a second source/drain junction formed in the first semiconductor fin. A first gate stack is formed on sidewalls of the first gate channel. A first spacer is interposed between the first gate stack and the first source/drain junction.
Bibliography:Application Number: US201514803523