Semiconductor device and method for forming the same

A system and method for forming and using a liner is provided. An embodiment comprises forming an opening in an inter-layer dielectric over a substrate and forming the liner along the sidewalls of the opening. A portion of the liner is removed from a bottom of the opening, and a cleaning process may...

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Bibliographic Details
Main Authors LAI CHIA-HAN, WANG MEI-YUN, TSAI WENI, LEI MING-TA, CHEN FANGNG, CHEN YUNGUNG, CHEN HUANG-MING, WU CHII-MING
Format Patent
LanguageEnglish
Published 02.02.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A system and method for forming and using a liner is provided. An embodiment comprises forming an opening in an inter-layer dielectric over a substrate and forming the liner along the sidewalls of the opening. A portion of the liner is removed from a bottom of the opening, and a cleaning process may be performed through the liner. By using the liner, damage to the sidewalls of the opening from the cleaning process may be reduced or eliminated. Additionally, the liner may be used to help implantation of ions within the substrate.
Bibliography:Application Number: US201113222502