Top wafer rotation and support

Embodiments of the present disclosure provide thermal processing chambers including a drive mechanism and a heating assembly disposed on opposite sides of a substrate support assembly. Particularly, the heating assembly is disposed below the substrate support assembly to process a substrate with a d...

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Bibliographic Details
Main Authors HUNTER AARON MUIR, SEREBRYANOV OLEG, RANISH JOSEPH M
Format Patent
LanguageEnglish
Published 19.01.2016
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FURNACES
FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL
HEATING
KILNS
LIGHTING
MECHANICAL ENGINEERING
OPEN SINTERING OR LIKE APPARATUS
OVENS
RETORTS
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:Embodiments of the present disclosure provide thermal processing chambers including a drive mechanism and a heating assembly disposed on opposite sides of a substrate support assembly. Particularly, the heating assembly is disposed below the substrate support assembly to process a substrate with a device side facing up and the drive mechanism is disposed above the substrate assembly.
Bibliography:Application Number: US201514674049