Display backlight with closely spaced light-emitting diode packages

• Main Authors: DOYLE DAVID A, GETTEMY SHAWN R
• Format: Patent
• Language: English
• Published: 19.01.2016
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LIGHTING; MECHANICAL ENGINEERING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; WEAPONS

An electronic device may be provided with a display having backlight structures that include a light guide plate formed from a clear polymer film. The polymer film may have an edge into which light is emitted from an adjacent array of light-emitting diodes. The light emitting diodes may each include a semiconductor device that emits light. The semiconductor device in each diode may be mounted on lead frame structures and wirebonded to the lead frame structures with first and second wire bonds. To improve backlight homogeneity and thereby reduce the mixing distance for light in the light guide plate, the diodes may be spaced closely together using diode packages having end faces that are free of lead frame structures. Exposed lead frame structures for soldering the light-emitting diodes to a substrate may be formed under the light-emitting diodes and on rear surfaces of the light-emitting diodes.