Three-dimensional chip-to-wafer integration

An integrated circuit device is disclosed that includes a semiconductor substrate and a die attached to the semiconductor substrate. A conductive pillar is connected to at least one of the semiconductor substrate or the die. An overmold is molded onto the semiconductor substrate over the die, and th...

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Bibliographic Details
Main Authors THAMBIDURAI KARTHIK, NGUYEN HIEN D, KELKAR AMIT SUBHASH, KHANDEKAR VIREN
Format Patent
LanguageEnglish
Published 17.11.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit device is disclosed that includes a semiconductor substrate and a die attached to the semiconductor substrate. A conductive pillar is connected to at least one of the semiconductor substrate or the die. An overmold is molded onto the semiconductor substrate over the die, and the conductive pillar extends through the overmold.
Bibliography:Application Number: US201113281534