Probe and method of manufacture for semiconductor wafer characterization

A conductive probe for semiconductor material characterization includes a distal metallic layer of micrometer-size particles, an intermediate layer of conformable conductive elastomer material, and a pin attached to the elastomer layer. The probe is preferably manufactured by filling a recess in a b...

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Bibliographic Details
Main Authors CHEN DONG, MUNCH MARK
Format Patent
LanguageEnglish
Published 03.11.2015
Subjects
ADVERTISING
ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICESUSING STATIC MEANS TO PRESENT VARIABLE INFORMATION
CRYPTOGRAPHY
DISPLAY
EDUCATION
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEALS
TESTING
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Summary:A conductive probe for semiconductor material characterization includes a distal metallic layer of micrometer-size particles, an intermediate layer of conformable conductive elastomer material, and a pin attached to the elastomer layer. The probe is preferably manufactured by filling a recess in a bottom plate with the metallic particles, coupling a top plate thereto with a perforation aligned with the recess, and filling the perforation with uncured conductive elastomer. The pin, preferably spring-loaded, is pressed into the perforation to compress the silicone to its intended probe size. The silicone is then allowed to cure at room temperature or in a heated environment, or both.
Bibliography:Application Number: US201213715486