Wiring board, semiconductor device, and method of manufacturing wiring board

• Main Authors: ROKUGAWA AKIO, SHIMIZU NORIYOSHI, KOYAMA TOSHINORI
• Format: Patent
• Language: English
• Published: 20.10.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A wiring board includes a first via hole in a first insulating layer to expose a first wiring layer. A first via in the first via hole includes an end surface. A second wiring layer is arranged on the first insulating layer and the end surface of the first via. A second insulating layer covers the s...