Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof

An article comprises a solvent cast film comprising a polyetherimide comprising structural units derived from a dianhydride component selected from the group consisting of 3,4′-oxydiphthalic anhydride, 3,3′-oxydiphthalic anhydride, 4,4′-oxydiphthalic anhydride, and combinations thereof, and a diamin...

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Bibliographic Details
Main Authors MULLEN TARA J, ODLE ROY RAY, HAGBERG ERIK, CHAN KWOK PONG
Format Patent
LanguageEnglish
Published 13.10.2015
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Summary:An article comprises a solvent cast film comprising a polyetherimide comprising structural units derived from a dianhydride component selected from the group consisting of 3,4′-oxydiphthalic anhydride, 3,3′-oxydiphthalic anhydride, 4,4′-oxydiphthalic anhydride, and combinations thereof, and a diamine component. The polyetherimide has a glass transition temperature that is at least 190° C. The film has a coefficient of thermal expansion of less than 60 ppm/° C., a thickness from 0.1 to 250 micrometers, and less than 5% residual solvent by weight. The film has less than 15 molar % of a member selected from the group consisting of biphenyltetracarboxylic acid, dianhydrides of biphenyltetracarboxylic acid, esters of biphenyltetracarboxylic acid, and combinations thereof.
Bibliography:Application Number: US20070758773