Semiconductor devices having through electrodes, semiconductor packages including the same, electronic systems including the same, and methods of manufacturing the same

• Main Author: YANG JU HEON
• Format: Patent
• Language: English
• Published: 08.09.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device may include a substrate including a first surface and a second surface, a through electrode penetrating the substrate to include a protrusion that protrudes from the second surface of the substrate, and a front side bump electrically coupled to the through electrode and dispos...