Semiconductor substrate for an optical receiver

Embodiments of the present disclosure describe semiconductor substrate techniques and configurations for an optical receiver. In one embodiment, a system includes a semiconductor substrate having one or more optical alignment features formed in a surface of the semiconductor substrate and an optical...

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Bibliographic Details
Main Authors LIU ANSHENG, HECK JOHN, KIM BRIAN H
Format Patent
LanguageEnglish
Published 04.08.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:Embodiments of the present disclosure describe semiconductor substrate techniques and configurations for an optical receiver. In one embodiment, a system includes a semiconductor substrate having one or more optical alignment features formed in a surface of the semiconductor substrate and an optical receiver assembly coupled with the semiconductor substrate, the optical receiver assembly including a photodetector device coupled with the surface of the semiconductor substrate, wherein the one or more optical alignment features facilitate precise optical alignment between a lens assembly and the photodetector device when the lens assembly is coupled with the semiconductor substrate using the one or more optical alignment features. Other embodiments may be described and/or claimed.
Bibliography:Application Number: US201113997615