Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other
A display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the ma...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English |
Published |
28.07.2015
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness. |
---|---|
Bibliography: | Application Number: US201414540391 |