Method of manufacturing a display device comprising a step of simultaneously polishing a second substrate and a semiconductor chip to have the same thickness as each other

A display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the ma...

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Bibliographic Details
Main Author INO MASUMITSU
Format Patent
LanguageEnglish
Published 28.07.2015
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Summary:A display device including: a first substrate with a pixel switch and drivers mounted thereon; a second substrate disposed in facing relation to the first substrate; a material layer held between the first substrate and the second substrate and having peripheral edges sealed by a seal member, the material layer having an electrooptical effect; and a semiconductor chip mounted as a COG component on the first substrate, the semiconductor chip having a control system configured to control the drivers; wherein the semiconductor chip having a thickness equal to the total thickness of the seal member and the second substrate or larger than the thickness of the seal member and smaller than the total thickness.
Bibliography:Application Number: US201414540391