Die fracture detection and humidity protection with double guard ring arrangement

An electronic apparatus includes a semiconductor substrate, outer and inner guard rings disposed along a periphery of the semiconductor substrate, and first and second contact pads electrically coupled to the outer and inner guard rings, respectively. The outer and inner guard rings are electrically...

Full description

Saved in:
Bibliographic Details
Main Authors LAU NGAI MING, FENDER JASON R
Format Patent
LanguageEnglish
Published 30.06.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
Online AccessGet full text

Cover

More Information
Summary:An electronic apparatus includes a semiconductor substrate, outer and inner guard rings disposed along a periphery of the semiconductor substrate, and first and second contact pads electrically coupled to the outer and inner guard rings, respectively. The outer and inner guard rings are electrically coupled to one another to define a conduction path between the first and second contact pads. Each of the outer and inner guard rings includes an Ohmic metal layer having a plurality of gaps and further includes conductive bridges across the gaps. The gaps of the outer guard ring are laterally offset from the gaps of the inner guard ring such that the Ohmic metal layers of the outer and inner guard rings laterally overlap.
Bibliography:Application Number: US201313922759