Zero stand-off bonding system and method
A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substr...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | English |
Published |
23.06.2015
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate. |
---|---|
Bibliography: | Application Number: US201313762754 |