Zero stand-off bonding system and method

A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substr...

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Bibliographic Details
Main Authors WU YI-WEN, HO MING, PU HAN-PING, MENG HSIEN-LIANG, LIN CHUN-HUNG, CHEN YU-FENG
Format Patent
LanguageEnglish
Published 23.06.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.
Bibliography:Application Number: US201313762754