Solid-state imaging device

According to one embodiment, a solid-state imaging device includes a first structure part, a second structure part, and a third structure part. The first structure part includes a first insulating body and a first photoelectric conversion part. The first photoelectric conversion part is periodically...

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Bibliographic Details
Main Authors KONNO YUSAKU, OKADA NAOTADA, YABUKI MOTO
Format Patent
LanguageEnglish
Published 16.06.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to one embodiment, a solid-state imaging device includes a first structure part, a second structure part, and a third structure part. The first structure part includes a first insulating body and a first photoelectric conversion part. The first photoelectric conversion part is periodically disposed in the first insulating body and selectively absorbs light in the first wavelength band. The second structure part includes a second insulating body and a second photoelectric conversion part. The second photoelectric conversion part is periodically disposed in the second insulating body and selectively absorbs light in the second wavelength band. The third structure part includes a third photoelectric conversion part. The third photoelectric conversion part absorbs light in a third wavelength band. When viewed in the light incidence direction, the first photoelectric conversion part, the second photoelectric conversion part, and the third photoelectric conversion part are disposed in this order.
Bibliography:Application Number: US201313759254