Boron ionization for aluminum oxide etch enhancement
Embodiments described herein generally provide a method for performing a semiconductor precleaning process. More specifically, embodiments provided herein relate to boron ionization for aluminum oxide etch enhancement. A process for removing native oxide from aluminum may utilize ionized boron alone...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
09.06.2015
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments described herein generally provide a method for performing a semiconductor precleaning process. More specifically, embodiments provided herein relate to boron ionization for aluminum oxide etch enhancement. A process for removing native oxide from aluminum may utilize ionized boron alone or in combination with a halogen plasma. The ionized boron may provide improved aluminum oxide etching properties while being highly selective for native oxides more generally. |
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Bibliography: | Application Number: US201314028099 |