Device for predicting deformation behavior of rubber material and method for predicting deformation behavior of rubber material

• Main Authors: AKUTAGAWA KEIZO, SHIMA HIROSHI, HAMATANI SATOSHI
• Format: Patent
• Language: English
• Published: 07.04.2015
• Subjects: ANALOGUE COMPUTERS; CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The present invention relates to a method for predicting a deformation behavior of a rubber material capable of accurately analyzing a deformation behavior of a rubber material even in a micro level, and more specifically, to a method for predicting a deformation behavior of a rubber material, including: generating a three-dimensional model of the rubber material formed by adding a filler to a rubber; applying a configuration condition specifying a relationship between a stress and a strain on the basis of thickness information and temperature information obtained on the basis of a molecular dynamics approach to a rubber layer portion constituting the three-dimensional model; and, analyzing the deformation behavior of the rubber material. Further, in the method for predicting a deformation behavior of a rubber material, it is preferable that the deformation behavior of the rubber material is analyzed by applying a finite element method to the three-dimensional model to which the configuration condition is applied.