Transparent heat shielding composition

Provided is a transparent heat shielding composition, which includes a thermoplastic resin material and a compound of formula (I) MxWO3-yAy  (I), wherein M is an alkali metal, W is tungsten, O is oxygen, A is halogen, 0<x 1 and 0<y 0.5.

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Bibliographic Details
Main Authors CHUNG PAO-TANG, JONG SUNG-JENG, CHANG YIH-HER, FU HUAI-KUANG, CHEN JER-YOUNG, XIAO TING-TING
Format Patent
LanguageEnglish
Published 03.03.2015
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:Provided is a transparent heat shielding composition, which includes a thermoplastic resin material and a compound of formula (I) MxWO3-yAy  (I), wherein M is an alkali metal, W is tungsten, O is oxygen, A is halogen, 0<x 1 and 0<y 0.5.
Bibliography:Application Number: US201313914224