Packaged semiconductor device

A packaged semiconductor device includes a substrate including a first major surface, a second major surface, first vias running between the first major surface and the second major surface, first contact pads contacting the first vias at the first major surface, second contact pads contacting the f...

Full description

Saved in:
Bibliographic Details
Main Author YAP WENG F
Format Patent
LanguageEnglish
Published 24.02.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A packaged semiconductor device includes a substrate including a first major surface, a second major surface, first vias running between the first major surface and the second major surface, first contact pads contacting the first vias at the first major surface, second contact pads contacting the first vias at the second major surface, and an opening between the first major surface and the second major surface. A first integrated circuit (IC) die is positioned in the opening in the substrate. Electrical connections are formed between the second IC die and the second contact pads. A first conductive layer is over the first contact pads and contact pads on the first IC die. Encapsulating material is on the second major surface of the substrate around the first IC die, the second IC die, the electrical connections, and between edges of the opening and edges of the first IC die.
Bibliography:Application Number: US201313781732