Modified via bottom for BEOL via efuse

A method of forming an electronic fuse including providing an Mx level including a first Mx metal, a second Mx metal, and an Mx cap dielectric above of the first and second Mx metal, forming an Mx+1 level above the Mx level, the Mx+1 level including an Mx+1 metal and a via electrically connecting th...

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Bibliographic Details
Main Authors FILIPPI RONALD G, SIMON ANDREW H, CHOI SAMUEL S, BAO JUNJING, LUSTIG NAFTALI E, BONILLA GRISELDA
Format Patent
LanguageEnglish
Published 30.12.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of forming an electronic fuse including providing an Mx level including a first Mx metal, a second Mx metal, and an Mx cap dielectric above of the first and second Mx metal, forming an Mx+1 level above the Mx level, the Mx+1 level including an Mx+1 metal and a via electrically connecting the second Mx metal to the Mx+1 metal in a vertical orientation, and forming a nano-pillar from the Mx cap dielectric at a bottom of the via and above the second Mx metal, the nano-pillar having a height less than a height of the via.
Bibliography:Application Number: US201313732466