Methods and apparatus for thermal based substrate processing with variable temperature capability

A substrate support may include a body; an inner ring disposed about the body; an outer ring disposed about the inner ring forming a first opening therebetween; a first seal ring disposed above the first opening; a shadow ring disposed above the inner ring, extending inward from the outer ring and f...

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Main Authors KARAZIM MICHAEL P, CUVALCI OLKAN, WANG BENJAMIN CHENG, LIN JING, YUAN XIAOXIONG, TZU GWOUAN, KHANDELWAL AMIT, WU KAI, GELATOS AVGERINOS V
Format Patent
LanguageEnglish
Published 30.12.2014
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Summary:A substrate support may include a body; an inner ring disposed about the body; an outer ring disposed about the inner ring forming a first opening therebetween; a first seal ring disposed above the first opening; a shadow ring disposed above the inner ring, extending inward from the outer ring and forming a second opening between the shadow and outer rings; a second seal ring disposed above the second opening; a space at least partially defined by the body and the inner, outer, first, second, and shadow rings; a first gap defined between a processing surface of a substrate when present and the shadow ring; and a plurality of second gaps fluidly coupled to the space; wherein the first gap and the plurality of second gaps are configured such that, when a substrate is present, a gas provided to the space flows out of the space through the first gap.
Bibliography:Application Number: US201113169373