Semiconductor element cooling structure

• Main Authors: YOKOI YUTAKA, YOSHIDA TADAFUMI, OSADA HIROSHI
• Format: Patent
• Language: English
• Published: 30.12.2014
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COLD ROOMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT PUMP SYSTEMS; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; ICE-BOXES; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; PRINTED CIRCUITS; REFRIGERATION OR COOLING; REFRIGERATORS; SEMICONDUCTOR DEVICES; WEAPONS

A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the semiconductor element and having a case and a latent heat storage material.