Package structures to improve on-chip antenna performance

A radio frequency integrated circuit (RFIC) chip package is provided having an RFIC chip and an integrated antenna structure. The integrated antenna structure includes an on-chip antenna having one or more radiator elements formed as part of a back-end-of-line structure of the RFIC chip. The antenna...

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Bibliographic Details
Main Authors SHAMIM ATIF, TSANG CORNELIA K.-I, DANG BING, MARNAT LOÏC, LIU DUIXIAN
Format Patent
LanguageEnglish
Published 23.12.2014
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRICITY
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Summary:A radio frequency integrated circuit (RFIC) chip package is provided having an RFIC chip and an integrated antenna structure. The integrated antenna structure includes an on-chip antenna having one or more radiator elements formed as part of a back-end-of-line structure of the RFIC chip. The antenna structure further includes a superstrate structure disposed on the back-end-of-line structure of the RFIC chip. The superstrate structure includes at least one substrate layer and a focusing metal element. The focusing metal element has a structure that is complementary to the on-chip radiator elements and which is configured to focus electromagnetic radiation to and from the planar antenna structure. The superstrate structure improves the performance (e.g., antenna gain and bandwidth) of the on-chip antennas for millimeter-wave applications.
Bibliography:Application Number: US201213686377