Expanded polypropylene resin particles, and polypropylene resin in-mold-expanded molding

Polypropylene resin expanded particles comprises a polypropylene resin as a base material resin, the polypropylene resin having at least three melting peaks on a DSC curve for a second temperature rise measured at a heating rate of 10 g/min with use of a heat flux differential scanning calorimeter (...

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Bibliographic Details
Main Author SENDA KENICHI
Format Patent
LanguageEnglish
Published 18.11.2014
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Summary:Polypropylene resin expanded particles comprises a polypropylene resin as a base material resin, the polypropylene resin having at least three melting peaks on a DSC curve for a second temperature rise measured at a heating rate of 10 g/min with use of a heat flux differential scanning calorimeter (DSC), the at least three melting peaks including (i) a lowest temperature melting peak of 100° C. to 130° C. and (ii) a highest temperature melting peak of 140° C. to 160° C., the polypropylene resin having a resin DSC ratio change rate of 0.5%/° C. to 3.0%/° C., the expanded particles having two melting peaks in a DSC measurement made at a first temperature rise at the heating rate of 10 g/min, the two melting peaks including, (i) on a lower temperature side, a melting peak temperature of 100° C. to 130° C. and, (ii) on a higher temperature side, a melting peak temperature of 140° C. to 160° C.
Bibliography:Application Number: US201213982783