Polishing solution for copper polishing, and polishing method using same

• Main Authors: SHINODA TAKASHI, ONO HIROSHI, OKADA YUUHEI
• Format: Patent
• Language: English
• Published: 04.11.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The polishing solution for copper polishing of the invention comprises a first organic acid component which is at least one type selected from among an organic acid containing a hydroxyl group, an organic acid salt and an organic acid anhydride, an inorganic acid component which is at least one type...