Methods of producing structures using a developer-soluble layer with multilayer technology

Methods of forming microelectronic structures using multilayer processes are disclosed. The methods comprise the use of a developer-soluble protective layer adjacent the substrate surface in a multilayer stack to protect the substrate during pattern transfer. After etching, the pattern is transferre...

Full description

Saved in:
Bibliographic Details
Main Authors WASHBURN CARLTON ASHLEY, FURSE JUSTIN LEE, LAMB, III JAMES E, SMITH BRIAN A, WANG HEPING
Format Patent
LanguageEnglish
Published 04.11.2014
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Methods of forming microelectronic structures using multilayer processes are disclosed. The methods comprise the use of a developer-soluble protective layer adjacent the substrate surface in a multilayer stack to protect the substrate during pattern transfer. After etching, the pattern is transferred into the developer-soluble protective layer using a developer instead of etching required by previous methods. Conventional developer-soluble anti-reflective coatings and gap-fill materials can be used to form the protective layer. Custom layers with developer solubility can also be prepared. Microelectronic structures formed by the above processes are also disclosed.
Bibliography:Application Number: US201113197941