Substrate backing device and substrate thermocompression-bonding device

• Main Authors: MOTOMURA KOJI, SAKAI TADAHIKO, MARUO HIROKI, EIFUKU HIDEKI
• Format: Patent
• Language: English
• Published: 07.10.2014
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; HAND TOOLS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANIPULATORS; PERFORMING OPERATIONS; PORTABLE POWER-DRIVEN TOOLS; PRESSES; PRESSES IN GENERAL; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A substrate backing device places and holds a rigid substrate thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate thereto. The substrate backing device includes a plate-shaped backing plate provided with a backing support surface adapted to come into contact with the lower surface of the rigid substrate for supporting it. The backing support surface is provided with an opening portion having a planar opening shape encompassing the area of the rigid substrate to be compressively bonded to the flexible substrate. The backing support surface is provided, within the opening portion, a receiving member which, during the thermocompression bonding operations, come into contact with the lower surface of the rigid substrate and with an already-mounted component having been preliminarily mounted on this lower surface in the compression-bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force.