Flip chip assembly process for ultra thin substrate and package on package assembly

In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the s...

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Bibliographic Details
Main Authors LIM SIH FEI, LOKE MUN LEONG, ONG KANG EU, RUDGE A. VETHANAYAGAM, MONG WENG KHOON, LIM BOK SIM, ONE TEAN WEE
Format Patent
LanguageEnglish
Published 30.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
Bibliography:Application Number: US201213600547