Bipod flexure ring

A thermal coupling includes a first structure having a first coefficient of thermal expansion; a second structure having a second coefficient of thermal expansion lower than the first coefficient of thermal expansion; a plurality of thermal expansion fingers provided in the first structure; a plural...

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Bibliographic Details
Main Authors KEITH WILLIAM P, HAND MICHAEL L
Format Patent
LanguageEnglish
Published 16.09.2014
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Summary:A thermal coupling includes a first structure having a first coefficient of thermal expansion; a second structure having a second coefficient of thermal expansion lower than the first coefficient of thermal expansion; a plurality of thermal expansion fingers provided in the first structure; a plurality of thermal expansion flanges extending from the plurality of thermal expansion fingers, respectively; and a flange extending from the second structure and attached to the plurality of thermal expansion flanges.
Bibliography:Application Number: US201213649770