Bipod flexure ring
A thermal coupling includes a first structure having a first coefficient of thermal expansion; a second structure having a second coefficient of thermal expansion lower than the first coefficient of thermal expansion; a plurality of thermal expansion fingers provided in the first structure; a plural...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
16.09.2014
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Subjects | |
Online Access | Get full text |
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Summary: | A thermal coupling includes a first structure having a first coefficient of thermal expansion; a second structure having a second coefficient of thermal expansion lower than the first coefficient of thermal expansion; a plurality of thermal expansion fingers provided in the first structure; a plurality of thermal expansion flanges extending from the plurality of thermal expansion fingers, respectively; and a flange extending from the second structure and attached to the plurality of thermal expansion flanges. |
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Bibliography: | Application Number: US201213649770 |