Integrated circuit apparatus, systems, and methods
High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
09.09.2014
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| Subjects | |
| Online Access | Get full text |
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| Abstract | High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed. |
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| AbstractList | High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed. |
| Author | SILVESTRI PAUL A |
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| Notes | Application Number: US201313953427 |
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| PublicationDateYYYYMMDD | 2014-09-09 |
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| RelatedCompanies | MICRON TECHNOLOGY, INC |
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| Snippet | High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES |
| Title | Integrated circuit apparatus, systems, and methods |
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